Document Type and Number:
Japanese Patent JPS3925671
Kind Code:
B1
Abstract:
A transparent electrically conductive film of copper sulphide is formed on a substrate by depositing a film of copper or a reactive copper compound on the substrate and then contacting the film with a sulphur-containing gas, which converts at least the surface of the film to copper sulphide. The reactive copper compounds may be the iodide bromide acetate, sulphate, chloride, nitrate, or a chelate, e.g. of E.D.T.A., and are applied to the substrate by vacuum deposition, electrodeposition, or from suspensions. Substrates specified are vitreous silica, or optically clear polymers, e.g. polyvinyl chloride or fluoride, polyvinylidene, polyethylene, esters, e.g. terephthalate, of 100m thickness. The copper sulphide film may be 10-1000m thick. Suitable sulphur-containing gases are hydrogen sulphide or polysulphide, methyl mercaptan, dimethyl sulphide, thiocyanic acid, or heated ammonium sulphide. The gas is preferably applied to the heated substrate, and the copper sulphide film contains excess of sulphur and may include compounds ranging from Cu2S to Cu9S5. Preferably the coating contains 0.7-1.4 mols Cu per mol of S to achieve adequate electrical conductivity. Forms of apparatus are described (not shown) in which a polymeric tape passes through a chamber where it is coated with copper by vapour deposition in vacuo; the copper source is removed, and the tape reeled with a kraft paper interleaving strip. The strip is then treated with H2S gas at 100-120 DEG C., the kraft paper giving good penetration into the copper coating. The product, which still retains a copper metal intermediate coat, may be used for recording. Details are given of optical and resistance tests with controls to provide optimum results.
Application Number:
JP3570162A
Publication Date:
November 13, 1964
Filing Date:
August 28, 1962
Export Citation:
International Classes:
C03C17/22; C23C8/08; C23C14/20; C23C14/56; C23C14/58; C23C26/00; G03G5/10; H01B1/00