Document Type and Number:
Japanese Patent JPS4864579
Kind Code:
A
Abstract:
An improved vacuum chuck for holding a thin fragile workpiece, such as a silicon wafer used as an electronic component, as the workpiece is being polished. The improved chuck has a removable and replaceable ring surrounding the workpiece to hold the workpiece in the event of an accidental loss of vacuum, and the chuck is grooved to distribute the differential pressure across the wafer over the entire wafer to avoid distortion due to localized pressure differences. The increased holding power of the chuck permits the use of higher downward pressures on the workpiece which speeds the polishing action both by increased abrasion and by increased chemical erosion which is accelerated by the higher heat of friction.
More Like This:
| JP6784570 | Holding table installation inspection method |
| JP2007227581 | UNIVERSAL CHUCK |
Application Number:
JP8860972A
Publication Date:
September 06, 1973
Filing Date:
September 04, 1972
Export Citation:
International Classes:
B23Q3/08; B24B37/04; B25B11/00; (IPC1-7): B24B41/00
Foreign References:
| US3052479A | 1962-09-04 |