Document Type and Number:
Japanese Patent JPS5030469
Kind Code:
A
More Like This:
| WO/2011/055672 | HYBRID SILICON WAFER |
Application Number:
JP8166973A
Publication Date:
March 26, 1975
Filing Date:
July 17, 1973
Export Citation:
International Classes:
C30B31/02; H01L21/22; H01L21/331; H01L29/73
Domestic Patent References:
| JP47048627A |
Foreign References:
| US3372067A | 1968-03-05 | |||
| US3575745A | 1971-04-20 |