Login| Sign Up| Help| Contact|

Patent Searching and Data


Document Type and Number:
Japanese Patent JPS5163477
Kind Code:
U
Application Number:
JP13704374U
Publication Date:
May 19, 1976
Filing Date:
November 14, 1974
Export Citation:
Click for automatic bibliography generation   Help
International Classes:
A63F7/02; (IPC1-7): A63F7/10



 
Previous Patent: JPS5163476

Next Patent: THERMOSETTING ADHESIVE COMPOSITION AND BONDING METHOD USING THE SAME