Title:
THERMOSETTING ADHESIVE COMPOSITION AND BONDING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JPH05163478
Kind Code:
A
Abstract:
PURPOSE: To obtain a new thermosetting type adhesive composition having good heat resistance and adhesion and capable of forming strong adhesion part, especially to thermal shock.
CONSTITUTION: The objective multi-liquid type thermosetting type adhesive composition is obtained by combining a liquid A consisting of a polyisocyanate compound with a liquid B obtained by blending a polyol compound with a polyepoxy compound and a curing catalyst in a specific ratio. Strong adhesion can be carried out by mixing the liquid A with the liquid B in bonding, applying the mixed liquid to a surface to be adhesively bonded or impregnating the mixed liquid into the surface to be adhesively bonded and then thermally curing the mixed liquid.
Inventors:
NISHIHARA TOSHIO
UMETANI HIROYUKI
NITTA HIDEKI
UMETANI HIROYUKI
NITTA HIDEKI
Application Number:
JP35116591A
Publication Date:
June 29, 1993
Filing Date:
December 13, 1991
Export Citation:
Assignee:
TEIJIN LTD
International Classes:
B29C65/48; C09J163/00; C09J175/00; C09J175/04; B29K75/00; (IPC1-7): B29C65/48; B29K75/00; C09J163/00; C09J175/04
Domestic Patent References:
| JPS6348377A | 1988-03-01 | |||
| JPH01287126A | 1989-11-17 | |||
| JPS58122977A | 1983-07-21 |
Attorney, Agent or Firm:
Maeda Junhiro