PURPOSE: To connect the pellet accurately under excellent yield by a method wherein, in the lead frame for semiconductor device, the pelleting surface of tab is located one step higher than the tab lead surface.

CONSTITUTION: The tab lead is bent upward halfway and the main surface to be the pelleting surface of tab 1 is located higher than the wire fixing surface. The floating of tab 1 is formed by press operation. After coating the main surface of tab 1 with silver paste 2, the pellet 3 is fixed to tab 1 by means of baking said silver paste 2 for setting. After this pellet bonding, wire bonding is performed to connect each electrodes of pellet 3 and internal end of lead 4 using wire 5. Then after resin molding pellet 3, wire 5 and internal end of lead, unnecessary dam pieces and frame are cut off to manufacture the required semiconductor device.