Title:
PRETREATING SOLUTION FOR SILVER PLATING, SILVER PLATING METHOD AND SUBSTRATE
Document Type and Number:
Japanese Patent JPS5858295
Kind Code:
A
Abstract:
PURPOSE:To obtain a pretreating soln. for silver plating having functions of preventing substitution and enhancing adhesive strength by adding gold and water soluble mercaptan to a citric acid bath. CONSTITUTION:This pretreating soln. contains 4-15g/l citric acid, 40-120g/ l alkali metallic citrate, 20-200ppm gold as a water soluble gold compound and <=0.6g/l water soluble mercaptan. A substrate is electrolytically pretreated with the pretreating soln., and the pretreated substrate is directly plated with silver without carrying out striking. The electrolytic conditions include about 50-60 deg.C, about 10-30sec and about 3-7V. When the substrate is copper or a copper alloy, substitution is prevented by the electrolytic pretreatment, and when the substrate is nickel, a nickel alloy, iron or an iron alloy, the adhesive strength is enhanced.
Inventors:
SHIBATA MITSURU
TANAKA SHIGEKO
TANAKA SHIGEKO
Application Number:
JP15546181A
Publication Date:
April 06, 1983
Filing Date:
September 30, 1981
Export Citation:
Assignee:
NIPPON ELECTRO PLATING
International Classes:
C25D3/46; C25D5/10; C25D5/34; (IPC1-7): C25D3/46; C25D5/34
Domestic Patent References:
| JPS5852497A | 1983-03-28 |
Attorney, Agent or Firm:
Takeshi Takatsuki
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