Title:
【考案の名称】半導体フレ-ム押え部材
Document Type and Number:
Japanese Patent JPS5999440
Kind Code:
U
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Inventors:
Beshibe Masaji
Application Number:
JP19928482U
Publication Date:
July 05, 1984
Filing Date:
December 23, 1982
Export Citation:
International Classes:
H01L21/60; (IPC1-7): H01L21/60
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