Title:
【発明の名称】ハイブリッド回路で電気回路を製造する方法
Document Type and Number:
Japanese Patent JPS63500344
Kind Code:
A
Abstract:
A process for manufacturing an electric circuit using hybrid technology, in which at least one electric component (15) is secured by means of a bonding agent (14) in a printed circuit with tracks (11) made of a base metal which is suitable for bonding. The surfaces (17) of the base metal which are intended for the bonding process, preferably made of copper, are covered during the bonding proces and during the hardening of the bonding agent (14), which is performed at a high temperature, by a protective layer (13) which is removed before the bonding operation.
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Inventors:
Kyutsuner, Claus
Mayer, Bernhard
Mayer, Bernhard
Application Number:
JP50071086A
Publication Date:
February 04, 1988
Filing Date:
January 15, 1986
Export Citation:
Assignee:
Roberto Botushiyu Gezershyaft Mitt Beshiyu Renktel Haftung
International Classes:
H01R43/00; H01L21/58; H01L21/60; H01L21/603; H01L21/607; H01L25/16; H05K3/30; H05K1/03; H05K3/00; (IPC1-7): H01L21/60; H01R43/00
Attorney, Agent or Firm:
Toshio Yano