Title:
感光性樹脂組成物、絶縁膜、保護膜および電子機器
Document Type and Number:
Japanese Patent JPWO2008059808
Kind Code:
A1
Abstract:
The photosensitive resin composition of the present invention includes an alkali solubility resin including molecules each composed of a main chain having one end and the other end opposite to the one end, an organic group bonded to the one end thereof, the organic group having at least one unsaturated group, and a substituent group bonded to at least one of the other end of the main chain and a branch thereof, the substituent group having a cyclic chemical structure containing nitrogen atoms, and a photosensitive agent. Further, the insulating film of the present invention is composed of a cured product of the above photosensitive resin composition. Furthermore, the protective film of the present invention is composed of a cured product of the above photosensitive resin composition. Moreover, the Electronic equipment of the present invention is provided with the above protective film and insulating film.
Inventors:
Hideyuki Toyota
Application Number:
JP2008544133A
Publication Date:
March 04, 2010
Filing Date:
November 13, 2007
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
G03F7/023; H01L21/027
Domestic Patent References:
| JP2004085622A | 2004-03-18 | |||
| JP2006184660A | 2006-07-13 | |||
| JP2006309202A | 2006-11-09 | |||
| JP2004132994A | 2004-04-30 |
Foreign References:
| WO2008020469A1 | 2008-02-21 |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi