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Title:
回路素子実装用の基板、これを用いた回路装置およびエアコンディショナ
Document Type and Number:
Japanese Patent JPWO2008069260
Kind Code:
A
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Inventors:
Yusuke Igarashi
Jun Sakano
Yukitsugu Takahashi
Application Number:
JP2007073538W
Publication Date:
June 12, 2008
Filing Date:
November 29, 2007
Export Citation:
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Assignee:
SANYO Electric Co., Ltd.
International Classes:
H05K1/05; H01L23/12
Attorney, Agent or Firm:
Takashi Okada



 
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