Title:
接合材、接合材の製造方法および接合構造体の作製方法
Document Type and Number:
Japanese Patent JPWO2018155633
Kind Code:
A1
Abstract:
接合材（１０）は、表面加工された銀表面（１１ａ、１１ｂ）を備える。
Inventors:
Katsuaki Suganuma
Chin tentow
Toshiyuki Ishina
No Seung Jun
Choi Chang Yang
Chin tentow
Toshiyuki Ishina
No Seung Jun
Choi Chang Yang
Application Number:
JP2019501837A
Publication Date:
February 27, 2020
Filing Date:
February 23, 2018
Export Citation:
Assignee:
National University Corporation Osaka University
International Classes:
B23K20/00; B32B7/12; B32B15/01; H01L21/52
Attorney, Agent or Firm:
Hiroyuki Maei