Title:
COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/016428
Kind Code:
A1
Abstract:
A copper alloy material for electrical/electronic components, which is characterized by containing 0.7-2.5% by mass of Co, while containing Si in such an amount that the mass ratio between Co and Si (Co/Si) is not less than 3.5 but not more than 4.0, with the balance made up of Cu and unavoidable impurities. The copper alloy material is also characterized by having a crystal grain size of 3-15 μm.
Inventors:
MATSUO RYOSUKE (JP)
MIHARA KUNITERU (JP)
EGUCHI TATSUHIKO (JP)
MIHARA KUNITERU (JP)
EGUCHI TATSUHIKO (JP)
Application Number:
PCT/JP2009/063614
Publication Date:
February 11, 2010
Filing Date:
July 30, 2009
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
MATSUO RYOSUKE (JP)
MIHARA KUNITERU (JP)
EGUCHI TATSUHIKO (JP)
MATSUO RYOSUKE (JP)
MIHARA KUNITERU (JP)
EGUCHI TATSUHIKO (JP)
International Classes:
C22C9/06; C22F1/08; H01B1/02; C22F1/00
Foreign References:
| JP2008088512A | 2008-04-17 | |||
| JP2008056977A | 2008-03-13 | |||
| JPS63307232A | 1988-12-14 | |||
| JPH02277735A | 1990-11-14 | |||
| JP2000087158A | 2000-03-28 | |||
| JP2007169764A | 2007-07-05 | |||
| JP2008088512A | 2008-04-17 |
Other References:
See also references of EP 2333127A4
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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