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Title:
COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/016429
Kind Code:
A1
Abstract:
A copper alloy material for electrical/electronic components containing Co and Si as additional elements, wherein a compound A composed of Co and Si and having an average particle diameter of not less than 5 nm but less than 50 nm is dispersed, and at least one compound selected from the group consisting of a compound B containing one or neither of Co and Si and having an average particle diameter of not less than 50 nm but not more than 500 nm, a compound C containing both of Co and Si and an additional element and having an average particle diameter of not less than 50 nm but not more than 500 nm, and a compound D composed of Co and Si and having an average particle diameter of not less than 50 nm but not more than 500 nm, is also dispersed.  The copper alloy material for electrical/electronic components is also characterized in that the matrix copper alloy has a crystal grain size of 3-35 μm, and that the copper alloy material has a conductivity of not less than 50% IACS.

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Inventors:
MIHARA KUNITERU (JP)
MATSUO RYOSUKE (JP)
EGUCHI TATSUHIKO (JP)
Application Number:
PCT/JP2009/063615
Publication Date:
February 11, 2010
Filing Date:
July 30, 2009
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
MIHARA KUNITERU (JP)
MATSUO RYOSUKE (JP)
EGUCHI TATSUHIKO (JP)
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B1/02; C22F1/00
Foreign References:
JP2008088512A2008-04-17
JP2008056977A2008-03-13
JP2006274445A2006-10-12
JP2006161148A2006-06-22
JPS6187838A1986-05-06
JPS63307232A1988-12-14
JPH02129326A1990-05-17
JPH02277735A1990-11-14
JP2008088512A2008-04-17
JP2008056977A2008-03-13
JP2006161148A2006-06-22
JP2006265731A2006-10-05
JP2007314847A2007-12-06
JP2008075151A2008-04-03
JP2008075152A2008-04-03
JP2008202467A2008-09-04
Other References:
See also references of EP 2333128A4
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
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