Title:
LABEL FOR IN-MOLD MOLDING
Document Type and Number:
WIPO Patent Application WO/2010/087148
Kind Code:
A1
Abstract:
A label for in-mold molding comprises a laminate structure, the structure comprising a stretched film base material layer (A) composed of a resin composition containing an α-olefin based copolymer having a melting point of 105 to 170°C and a crystalline propylene based resin, and a heat sealing layer (B) laminated on the base material layer, and has an internal haze of 1 to 30% for a stack of ten labels, whereby when the label is adhered on a container, the shape of the container is not damaged, and the exterior appearance of the label is not damaged.
Inventors:
SUZUKI TATSUYA (JP)
IWASA YASUO (JP)
NAKAMURA KOU (JP)
IWASA YASUO (JP)
NAKAMURA KOU (JP)
Application Number:
PCT/JP2010/000421
Publication Date:
August 05, 2010
Filing Date:
January 26, 2010
Export Citation:
Assignee:
YUPO CORP (JP)
SUZUKI TATSUYA (JP)
IWASA YASUO (JP)
NAKAMURA KOU (JP)
SUZUKI TATSUYA (JP)
IWASA YASUO (JP)
NAKAMURA KOU (JP)
International Classes:
B29C45/14; B29C49/24; B29C51/16; B32B27/32; G09F3/04
Domestic Patent References:
| WO1992001723A1 | 1992-02-06 |
Foreign References:
| JP2001030342A | 2001-02-06 | |||
| JP2006168355A | 2006-06-29 | |||
| JPH0284319A | 1990-03-26 | |||
| JPH03260689A | 1991-11-20 | |||
| JP2006276848A | 2006-10-12 |
Other References:
See also references of EP 2392443A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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