Title:
２層フレキシブル配線板およびその製造方法
Document Type and Number:
Japanese Patent JP6398175
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a flexible wiring board excellent in folding resistance and its production method.SOLUTION: A two-layer flexible wiring board is provided with wiring of a metal laminate which has a base metal layer arranged on the surface of a resin film substrate, without through an adhesive, and is composed of a nickel alloy and a copper layer arranged on the surface of the base metal layer. The ratio (OR/OR) of the crystal ratio ORin the 111 orientation to the crystal ratio ORin the 001 orientation is 7 or lower for crystals contained in the range from the surface of a resin film substrate of the metal laminate to the depth of 0.4 μm, measured by electron beam back scattering diffractometry(EBSD); the (111) crystal orientation degree index of the copper layer is 1.2 or greater; and the difference d[(200)/(111)] of the crystal orientation ratio [(200)/(111)] of the copper layer is 0.03 or greater, measured before and after execution of a folding resistance test (folding resistance test specified by JIS C-5016-1994).
Inventors:
Hiroshi Takenouchi
Masashi Noguchi
Yoshihide Nishiyama
Shimamura Tomio
Mr. Kogami
Hiroki Hata
Masashi Noguchi
Yoshihide Nishiyama
Shimamura Tomio
Mr. Kogami
Hiroki Hata
Application Number:
JP2013220429A
Publication Date:
October 03, 2018
Filing Date:
October 23, 2013
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
C25D5/56; B32B15/08; C23C14/14; C23C14/20; C25D5/18; H05K1/03; H05K1/09; H05K3/18
Domestic Patent References:
| JP2009295656A | ||||
| JP2010265499A | ||||
| JP8283886A | ||||
| JP2011017036A |
Foreign References:
| WO2008090654A1 | ||||
| US6045713 |
Attorney, Agent or Firm:
Yoshitaka Oshida