Title:
3次元造形装置および3次元造形方法
Document Type and Number:
Japanese Patent JP7084224
Kind Code:
B2
Abstract:
The three-dimensional shaping device (100) is provided with a powder supply device (10) to supply powder (90) by dropping the powder toward a surface (81) of a workpiece (80) as a shaping object, the surface, for example, being a curved surface. Further, the three-dimensional shaping device (100) is provided with a laser light irradiation device (20) to irradiate a layer of the powder (90) supplied and deposited by the powder supply device (10) with a laser light (25) as an energy beam. In this way, a three-dimensional shaping device and a three-dimensional shaping method, which are capable of shaping a beam structure on a curved surface of a shaping object, are provided.
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Inventors:
Eiichi Maehana
Daisuke Noda
Kurikawa Tsunemoto
Mizutani Masayoshi
Daisuke Noda
Kurikawa Tsunemoto
Mizutani Masayoshi
Application Number:
JP2018116750A
Publication Date:
June 14, 2022
Filing Date:
June 20, 2018
Export Citation:
Assignee:
Komatsu NTC Ltd.
International Classes:
B22F10/28; B22F10/37; B22F10/38; B22F12/90; B33Y10/00; B33Y30/00
Domestic Patent References:
JP2000190086A | ||||
JP2001047520A |
Foreign References:
WO2017157648A1 | ||||
WO2016075803A1 |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office
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