Title:
ABRASIVE GRAIN FIXED WIRE MANUFACTURING DEVICE FOR WIRE SAW
Document Type and Number:
Japanese Patent JP2515212
Kind Code:
B2
Abstract:
PURPOSE: To provide a device which effectively produces abrasion grain fixed wires which easily drops chips in a tool wire manufacturing device for wire saws on the surface of the core of which abrasive grains are fixed (electronically deposited).
CONSTITUTION: A wire 1 is made to pass along the axis line of a cylindrical or conical abrasive grain tank 23 which is filled with abrasive grains 21 soaked in galvanizing liquid, and a spiral shield plate 35 whose axis line is aligned with that of the abrasive grain tank 23, which is rotatable around the axis line, is secured in the outer periphery, and the shield plate 35 and a feeding device to axially feed the wire 1 are linked with each other sos that when the wire 1 is fed by same length as the lead of the spiral of the shield plate 35, the shield plate 35 makes one revolution around the axis line. The tool wire to be manufactured, on the surface of a core of which abrasive grains are spirally fixed, and chips retain in a spiral groove like part where abrasive grains are not fixed and drop.
Inventors:
ISHIKAWA KENICHI
Application Number:
JP24555392A
Publication Date:
July 10, 1996
Filing Date:
August 21, 1992
Export Citation:
Assignee:
ISHIKAWA KENICHI
FUJIKOSHI KIKAI KOGYO KK
FUJIKOSHI KIKAI KOGYO KK
International Classes:
B23P15/28; B23D61/18; B24B27/06; B24D11/00; B24D18/00; (IPC1-7): B24B27/06; B24D11/00
Domestic Patent References:
| JP1193176A | ||||
| JP6438250A | ||||
| JP5854198B2 |
Attorney, Agent or Firm:
Takao Nishi