Title:
ウインドウを備える研磨パッド
Document Type and Number:
Japanese Patent JP2006527476
Kind Code:
A
Abstract:
The present invention relates to a polishing pad. In particular, the polishing pad of the present invention can include a window area. The window area can be formed in the pad using a cast-in-place process. The polishing pad of the present invention can be useful for polishing articles and can be especially useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer. The window area of the polishing pad of the present invention can be particularly useful for polishing or planarizing tools that are equipped with through-the-platen wafer metrology.
Inventors:
Swisher, Robert G.
One, Alan Yi.
Allison, William Sea.
One, Alan Yi.
Allison, William Sea.
Application Number:
JP2005518600A
Publication Date:
November 30, 2006
Filing Date:
March 29, 2004
Export Citation:
Assignee:
Ppee Industries Industries Ohio, Inc.
International Classes:
H01L21/304; B24B37/20; B24D13/14; B24D18/00
Domestic Patent References:
| JP2003048151A | 2003-02-18 | |||
| JP2002001647A | 2002-01-08 | |||
| JPH1177525A | 1999-03-23 | |||
| JPH11512977A | 1999-11-09 | |||
| JP2003507199A | 2003-02-25 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita