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Patent Searching and Data


Title:
ABS RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JPH08245856
Kind Code:
A
Abstract:

PURPOSE: To obtain an ABS resin composition which can give a molded product reduced in a distribution of wall thicknesses and is excellent in low-temperature impact strength by specifying its melt flow rate and its die swell ratio.

CONSTITUTION: This ABS resin has a melt flow rate of 1-20 at 220°C and a die swell ratio of 20-200. To mix the components of this composition, common mixers can be used. Among them, a vented extruder is desirable. A molded product of this composition can be obtained by a vacuum molding process or a pressure molding process. When the melt flow rate of this composition is below 1, the composition can not give a desired molded product by a pressure molding process due to the insufficient deformation of resin. On the contrary, when it is above 20, the deformation of the resin is excessive, the handling of the heated sheet to the molding machine is difficult and the impact strength of the molded product lowers.


Inventors:
MUROI TOSHIMASA
ITO MASAO
Application Number:
JP4970095A
Publication Date:
September 24, 1996
Filing Date:
March 09, 1995
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
B29C41/50; B29C51/10; C08L55/00; C08L55/02; (IPC1-7): C08L55/02; B29C41/50; B29C51/10