To provide an acoustic cooling device capable of obtaining high thermal conducting performance without generating large pressure loss in an air flow within an acoustic pipe.
In this acoustic cooling device, an acoustic wave generation device 2 is disposed to face to a conduit of the acoustic pipe 1, a stack 3 is disposed at a prescribed position within the acoustic pipe 1, and a high temperature side heat exchanger 4 and a low sound side heat exchanger 5 are joined to an end face of a high temperature side of the stack 3 and an end face of a low sound side, respectively. In the high temperature side heat exchanger 4, the stack 3 and the low sound side heat exchanger 5, a plurality of through holes 41, 31, 51 are opened to disperse in all cross section regions of the conduit of each acoustic pipe 1. Each of the through holes 41 opened in the high temperature side heat exchanger 4, the through holes 31 opened in the stack 3 and the through holes 51 opened in the low sound side heat exchanger 5 is aligned on a straight line.
UCHIYAMA NAOYUKI
KUROKAWA MICHIHIRO
