Title:
ACTIVE RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2019174549
Kind Code:
A
Abstract:
To provide a resist composition and the like, by which generation of cracks can be suppressed upon forming a pattern made of a thick resist film and CD variations and cross-sectional shape changes in patterns obtained immediately after the preparation of the composition and obtained after stored for a given period of time after the preparation.SOLUTION: The present invention discloses an active ray-sensitive or radiation-sensitive composition comprising (A) saccharides and/or saccharide derivatives, (B) a resin having a repeating unit having a polar group and a repeating unit having an acid decomposable group, a photo-acid generator, and a solvent, in which a solid content percentage exceeds 20 mass% and the content of the compound (A) with respect to the resin (B) by a mass ratio is 0.04 or more and 0.45 or less. The present invention discloses an active ray-sensitive or radiation-sensitive film formed from the above active ray-sensitive or radiation-sensitive film, a pattern forming method using the active ray-sensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.SELECTED DRAWING: None
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Inventors:
TSUBAKI HIDEAKI
TOMIGA TAKAMITSU
AZUMA KOHEI
TOMIGA TAKAMITSU
AZUMA KOHEI
Application Number:
JP2018060622A
Publication Date:
October 10, 2019
Filing Date:
March 27, 2018
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
G03F7/039; C07C25/18; C07C309/06; C07C309/17; C07C381/12; C08F220/10; G03F7/004
Attorney, Agent or Firm:
Patent Business Corporation Koei Patent Office