Title:
付加硬化型シリコーン接着剤組成物
Document Type and Number:
Japanese Patent JP7399563
Kind Code:
B2
Abstract:
To provide an addition-curable silicone adhesive composition which can be cured under a curing condition of low temperature and short time and is excellent in adhesion to various substrates.SOLUTION: The addition-curable silicone adhesive composition comprises (A) a polyorganosiloxane having two or more silicon-atom-coupled alkenyl groups in each molecule; (B) a polyorganohydrogensiloxane having three or more silicon-atom-coupled hydrogen atoms in each molecule ; (C) a platinum-based catalyst; (D) a silicon-based tackifier having two or more specific tackifying functional groups in total in each molecule; and (E) a vanadium compound in which the vanadium content is 10-50 mass%; where the content of the (E) component is 0.005-10 pts.mass based on 100 pts.mass of the (A) component, and where the content of the (C) component based on the total amount of the composition is the catalytic amount.SELECTED DRAWING: None
Inventors:
Koji Miyata
Masanori Takanashi
Isao Iida
Masanori Takanashi
Isao Iida
Application Number:
JP2019214556A
Publication Date:
December 18, 2023
Filing Date:
November 27, 2019
Export Citation:
Assignee:
Momentive Performance Materials Japan LLC
International Classes:
C09J183/07; C09J11/04; C09J11/06; C09J183/05
Domestic Patent References:
| JP2011026523A | ||||
| JP4246466A | ||||
| JP2019151695A | ||||
| JP2012184350A | ||||
| JP2007514796A | ||||
| JP60168614A |
Foreign References:
| WO2015033979A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Tsukuni
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