Title:
ADHESIVE COMPOSITION, ARTICLE AND LAMINATED PRESS BOARD
Document Type and Number:
Japanese Patent JP2023168946
Kind Code:
A
Abstract:
To provide: a styrene-free adhesive composition which can obtain sufficient adhesiveness between substrates and hardly causes peeling at the adhesive layer; and an article and a laminated press board using the adhesive composition.SOLUTION: There are provided: an adhesive composition which comprises at least one curable resin selected from the group consisting of an unsaturated polyester resin and a vinylester resin, an ethylenically unsaturated monomer other than styrene and optionally comprises an inorganic filler, wherein the ratio of the inorganic filler to the total of the curable resin, the ethylenically unsaturated monomer and the inorganic filler is 20 mass% or less; and an article and a laminated press board having a cured product of the adhesive composition.SELECTED DRAWING: None
Inventors:
DOI SHINICHI
SHIMA TAKUYA
ICHIOKA TAKAAKI
TAGUCHI SATOSHI
TAKAMI SHIGEYASU
SHIMA TAKUYA
ICHIOKA TAKAAKI
TAGUCHI SATOSHI
TAKAMI SHIGEYASU
Application Number:
JP2022080346A
Publication Date:
November 29, 2023
Filing Date:
May 16, 2022
Export Citation:
Assignee:
OJI HOLDINGS CORP
International Classes:
B27D1/10; C09J167/06; C09J4/00; C09J7/35; C09J11/04
Attorney, Agent or Firm:
Yasushi Matsunuma
Yuichiro Kawagoe
Noriko Yanai
Shunsuke Fushimi
Tetsuya Kimizuka
Yuichiro Kawagoe
Noriko Yanai
Shunsuke Fushimi
Tetsuya Kimizuka