Title:
可動部品固定用接着剤組成物、光学部品、電子部品、及び、電子モジュール
Document Type and Number:
Japanese Patent JP7431720
Kind Code:
B2
Abstract:
A purpose of the present invention is to provide an adhesive composition for fixing movable components which has excellent adhesiveness to both metals and non-metals, can be cured at low temperatures, and can prevent the movable components from shifting from the original positions. Another purpose of the present invention is to provide an optical component, an electronic component, and an electronic module all obtained using the adhesive composition for fixing movable components. The adhesive composition for fixing movable components of the present invention comprises a poly(vinyl acetal) resin, a compound having an epoxy group and/or a (meth)acryloyl group, and a polymerizable hardener and gives cured objects having a 25°C storage modulus of 1.0 GPa or greater.
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Inventors:
Hideyuki Hayashi
Application Number:
JP2020504248A
Publication Date:
February 15, 2024
Filing Date:
December 24, 2019
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C09J129/14; C09J4/00; C09J9/02; C09J11/04; C09J11/06; C09J163/02
Domestic Patent References:
| JP2012067221A | ||||
| JP2017013736A | ||||
| JP2017110128A | ||||
| JP201465032A | ||||
| JP2016125042A | ||||
| JP9154834A | ||||
| JP48102845A | ||||
| JP2020196881A |
Foreign References:
| WO2008035791A1 | ||||
| WO2020241728A1 |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus
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