Title:
パワーデバイス用冷却器
Document Type and Number:
Japanese Patent JP7431719
Kind Code:
B2
Abstract:
To provide a power device cooler that suppresses a temperature difference between the upstream and downstream of a coolant to thereby enable improvement of the cooling efficiency and reduction of the number of components, and enables a heat generating component to be easily attached to a heat receiving surface while the heat receiving surface is kept horizontal.SOLUTION: A power device cooler is comprised of: a flat cooler body 10 having a heat receiving surface 11 and a plurality of coolant flow paths 15 parallel to each other along a width direction orthogonal to a longitudinal direction; and a cover material 20 which is mounted on the side, opposite to the heat receiving surface 11, of the cooler body 10 and has a coolant inflow path 21 communicating with one end side of the coolant flow path 15 and a coolant outflow path 22 communicating with the other end side of the coolant flow path 15, the cooler body 10 is equipped with thick-walled portions 12a and 12b on both longitudinal ends of the cooler body 10, the thick-walled portion 12a on one end side is equipped with a coolant inlet 13 communicating with the coolant inflow path 21, the thick-walled portion 12b on the other end side is equipped with a coolant outlet 14 communicating with the coolant outlet 22.SELECTED DRAWING: Figure 2
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Inventors:
Kazuhito Seki
Tomomasa Hirayama
Shoichiro Ishida
Tomomasa Hirayama
Shoichiro Ishida
Application Number:
JP2020210997A
Publication Date:
February 15, 2024
Filing Date:
December 21, 2020
Export Citation:
Assignee:
NIPPON LIGHT METAL COMPANY,LTD.
Nikkei Kin ALMO Co., Ltd.
Nikkei Kin ALMO Co., Ltd.
International Classes:
H01L23/473; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
| JP2008172024A | ||||
| JP2006310485A | ||||
| JP2008205371A | ||||
| JP2006324647A | ||||
| JP2019140276A |
Foreign References:
| WO2015194259A1 |
Attorney, Agent or Firm:
Kikuhiko Nakamoto
Takeo Watanabe
Takeo Watanabe