Title:
ADHESIVE COMPOSITION AND MANUFACTURING METHOD OF WOODEN PLATE USING THE SAME
Document Type and Number:
Japanese Patent JP2003147309
Kind Code:
A
Abstract:
To provide an adhesive composition having excellent water resistance without containing formaldehyde, and to provide a manufacturing method of a natural wood decorative wooden plate using the composition.
The natural wood decorative wooden plate is obtained by thermocompression bonding a natural wood thin simple plate and a wooden series board using an adhesive composition comprising an ethylene-vinyl acetate copolymerized emulsion having a carboxy group in a molecule, an organic series filler, and a polymer having an oxazoline ring.
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Inventors:
KURIYAMA YOSHITSUGU
KIMURA OSAMU
SHIMA HIDEJI
KIMURA OSAMU
SHIMA HIDEJI
Application Number:
JP2001343791A
Publication Date:
May 21, 2003
Filing Date:
November 08, 2001
Export Citation:
Assignee:
KOYO SANGYO CO
International Classes:
B27D5/00; B27D1/04; C09J103/10; C09J131/04; C09J201/02; (IPC1-7): C09J131/04; B27D1/04; B27D5/00; C09J103/10; C09J201/02
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