Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2001294833
Kind Code:
A
Abstract:

To solve such problems that a plasticizer is required to be added for securing the low-temperature formation of film, and the impartment of flexibility to the adhesive film or the like in a vinyl acetate emulsion widely used in fields such as wood processing and paper processing, and the use of the conventional type emulsion is in the unpreferable circumference because it is doubted that the plasticizer is an endocrine disrupter.

This adhesive composition is obtained by compounding an ethylene-vinyl acetate copolymer emulsion having a ≤-10°C glass transition temperature with the vinyl acetate resin emulsion to improve the low- temperature film-forming properties and flexibility of the adhesive film, and to avoid the use of the plasticizer having the doubt of an endocrine disrupter.


Inventors:
ISOBE SATORU
YANO MASAHIRO
KUSHIDA MITSUGI
SUGIURA HIROSHI
Application Number:
JP2000107801A
Publication Date:
October 23, 2001
Filing Date:
April 10, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AICA KOGYO CO LTD
International Classes:
C09J131/04; (IPC1-7): C09J131/04
Domestic Patent References:
JPH09118721A1997-05-06
JPH09316415A1997-12-09
JPH07228849A1995-08-29
JPH11279507A1999-10-12
JPH1192734A1999-04-06
JPS56135575A1981-10-23