Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2016125054
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition allowing for formation of an adhesive layer having low glass transition temperature and enhanced heat resistance.SOLUTION: There is provided the adhesive composition containing: specific diamine; specific tetracarboxylic acid dianhydride; and acid anhydride represented by the following formula (4) or monoamine represented by the following formula (5), the amount of use of the acid anhydride or the monoamine being 0.1 to 10 mol%. In the formula (4), R is a hydrogen atom, a methyl group or a phenyl group, and in the formula (5), e Ris an ethynyl group, a cyano group or a phenylethynyl group and Ris a hydrogen atom, an ethynyl group, a cyano group or a phenylethynyl group.SELECTED DRAWING: None
More Like This:
Inventors:
SHIMOMURA YORIKO
SHIRONO TAKAFUMI
SAKAI NOBUSHI
NAKAYOSHI KAZUMI
ISHIKAWA KAZUTAKA
SHIRONO TAKAFUMI
SAKAI NOBUSHI
NAKAYOSHI KAZUMI
ISHIKAWA KAZUTAKA
Application Number:
JP2015197697A
Publication Date:
July 11, 2016
Filing Date:
October 05, 2015
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
C09J179/08; B32B9/00; B32B27/00; B32B27/34; C08G73/10; C09J7/02
Attorney, Agent or Firm:
Hatta International Patent Corporation