Title:
接着組成物
Document Type and Number:
Japanese Patent JP5688879
Kind Code:
B2
Abstract:
A sealing compound composition as an adhesive composition contains a vinyl chloride resin, a plasticizer, a filler, a moisture absorbent and an acrylic resin as a pH control material. The moisture absorbent is blended within a range of 0.3 to 2.0% by weight. The acrylic resin is blended within a range of 1.0% by weight or more to less than 7.0% by weight. A blending ratio of the moisture absorbent is half or less than that of the acrylic resin.
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Inventors:
田村 博
長野 孝昭
長野 孝昭
Application Number:
JP2009026360A
Publication Date:
March 25, 2015
Filing Date:
February 06, 2009
Export Citation:
Assignee:
アイシン化工株式会社
International Classes:
C09D201/00; C09D5/00; C09D7/12; C09D127/06; C09D133/00; C09D151/06; C09J5/02; C09J11/06; C09J11/08; C09J127/06; C09J133/00; C09J151/06; C09J201/00
Attorney, Agent or Firm:
Patent business corporation Vesta international patent firm