Title:
ADHESIVE FOR ELECTRONIC PART AND ARTICLE
Document Type and Number:
Japanese Patent JPH06322336
Kind Code:
A
Abstract:
PURPOSE: To provide an adhesive comprising a fluorine-containing polymer having a specific structure and having coupling groups in the molecule, excellent in heat resistance, moisture resistance, electric characteristics and reliability, and useful for semiconductor chips, flexible printing plates,, etc.
CONSTITUTION: The adhesive comprises a fluorine-containing polymer having a fluorine-containing aliphatic ring structure and having coupling groups in the molecule. The main chain structure of the fluorine-containing polymer in the adhesive is preferably a perfluoro structure.
Inventors:
YOKOZUKA TOSHISUKE
NAKAMURA HIDE
NAKAMURA HIDE
Application Number:
JP13283593A
Publication Date:
November 22, 1994
Filing Date:
May 11, 1993
Export Citation:
Assignee:
ASAHI GLASS CO LTD
International Classes:
C09J127/12; C09J133/04; C09J133/14; C09J137/00; H01L21/52; H05K3/38; (IPC1-7): C09J127/12; C09J133/14; C09J137/00; H01L21/52
Attorney, Agent or Firm:
Kenji Izumina