To provide a semiconductor wafer surface protecting adhesive film which protects a semiconductor wafer from breakage even if the wafer is thinned to have a thickness of 150 μm or less and can be peeled off the wafer in the same time as it takes in a conventional method, and to provide a semiconductor wafer protecting method using the adhesive film.
The semiconductor wafer surface protecting adhesive film is composed of a base film, and an adhesive layer formed on one surface thereof. The base film includes at least one resin layer (A) 10-200 μm thick, which shows a shrinkage factor both in a mechanical direction (MD direction) and in a direction perpendicular to the mechanical direction (TD direction) of less than 5% when manufactured at 50°C and shows a shrinkage factor at least either in the MD direction or in the TD direction of 5-99% when heated in hot water or an atmosphere of 70-100°C for one second or longer.
URAKAWA TOSHIYA
SAIMOTO YOSHIHISA
HAYAKAWA SHINICHI
