To provide a technology to transfer an adhesive layer on a wiring board without leaving the adhesive layer on a release film.

In an adhesive film 50, the release film 11, a first adhesive layer 51 and a second adhesive layer 52 are laminated in this order. The second adhesive layer 52 contains an epoxy resin, and a third organic solvent containing one or two or more of methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate and acetone. The content of the third organic solvent of the second adhesive layer 52 is higher than the content of an organic solvent contained in the first adhesive layer 51. The second adhesive layer 52 contains a fourth organic solvent containing one of or both of toluene and an alcohol which singly do not dissolve the epoxy resin. Since the third organic solvent can dissolve or swell an epoxy resin, the surface of the second adhesive layer 52 has tackiness.