FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE

Title:

FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2013010961

Kind Code:

A

Abstract:

To provide a die bonding film-like adhesive which can be laminated on a back surface of a wafer at a temperature lower than a softening temperature of a protecting tape for an extremely thin wafer or a dicing tape to be pasted while reducing thermal stress, such as warp of the wafer, and simplifying steps of manufacturing a semiconductor device, and exhibiting excellent heat resistance and reliability of moisture resistance; an adhesive sheet produced by pasting the film-like adhesive and the dicing tape; and a semiconductor device.

A film-like adhesive has at least an adhesive layer, wherein the adhesive layer contains (A) a polyimide resin having a SP value of 10.0 to 11.0 (cal/cm³)^1/2 and (B) an epoxy resin, and a tan δpeak temperature is -20 to 60°C and a flow amount is 100 to 1,500 μm.

Inventors:

MASUKO TAKASHI
OKUBO KEISUKE
HATAKEYAMA KEIICHI
YUSA MASAMI

Application Number:

JP2012181703A

Publication Date:

January 17, 2013

Filing Date:

August 20, 2012

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C09J179/08; C09J7/10; C09J11/04; C09J11/06; C09J163/00; C09J163/04; H01L21/52; H01L21/58; H01L21/68; H01L21/00

Domestic Patent References:

JP2002121530A	2002-04-26
JP2002158239A	2002-05-31
JP2002012845A	2002-01-15
JP2002226824A	2002-08-14

Attorney, Agent or Firm:

Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu

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