Title:
接着フィルム
Document Type and Number:
Japanese Patent JP5196703
Kind Code:
B2
Abstract:
An adhesive film (4) having a first resin layer (10), a second resin layer (20) formed on the front surface of the first resin layer (10), and a third resin layer (15) formed on the rear surface of the first resin layer (10), wherein the lowest viscosity in the temperature range lower than the bonding temperature of the first resin layer (10) is higher than the lowest viscosity in the temperature range lower than the bonding temperature of the second and third resin layers (20, 25). When first and second bodies (40, 50) to be bonded are hot pressed while sandwiching the adhesive film (4), the second resin layer (20) flows out toward the outside of the body (50). However, since the first resin layer (10) containing conductive particles (12) does not flow out but stays between the first and second bodies (40, 50), the number of conductive particles (12) sandwiched between first and second connection terminals (42, 52) increases.
Inventors:
Noriaki Kudo
Kyoji Akutsu
Hideji Hagi
Kyoji Akutsu
Hideji Hagi
Application Number:
JP2004007492A
Publication Date:
May 15, 2013
Filing Date:
January 15, 2004
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
B32B27/18; B32B27/08; C09J7/29; C09J9/02; C09J201/00; H01B5/16; H01B13/00; H01L21/60; H05K3/32
Domestic Patent References:
| JP7230840A | ||||
| JP4366630A | ||||
| JP3107888A | ||||
| JP200152778A |
Attorney, Agent or Firm:
Shigeo Ishijima
Hideki Abe
Hideki Abe