Title:
ADHESIVE MELTER HAVING PUMP INSTALLED IN HEATED HOUSING
Document Type and Number:
Japanese Patent JP2015202495
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hot-melt adhesive melter for use in various filling processes.SOLUTION: A melter includes a heater unit for melting adhesive, a reservoir for receiving the melted adhesive from the heater unit, and a pump being in fluid communication with the reservoir and located within a heated housing. The heated housing heats the pump during startup and regular operation of the adhesive melter, thereby reducing delays in operation caused by slow warming of the adhesive within the pump. The heated housing may be a manifold in fluid communication with the reservoir and with fluid outlets, but the heated housing may also be a separate heat block. In either type of embodiment, the pump is inserted with a cartridge style into the heated housing and held in position using a single locking fastener. Elements such as insulating external housings and mounting hooks may also be used to further encourage conductive heat transfer into the structure surrounding the pump.
Inventors:
CLARK STEVEN
DAVID R JETER
DAVID R JETER
Application Number:
JP2015082124A
Publication Date:
November 16, 2015
Filing Date:
April 14, 2015
Export Citation:
Assignee:
NORDSON CORP
International Classes:
B05C5/04; C09J5/06; C09J201/00
Attorney, Agent or Firm:
Okabe
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kosuke Uchida
Kawauchi Eiji
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kosuke Uchida
Kawauchi Eiji
Previous Patent: COATING METHOD BY INFLOW FROM SIDE FACE
Next Patent: SUPERNATANT WATER DISCHARGE DEVICE
Next Patent: SUPERNATANT WATER DISCHARGE DEVICE