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Title:
ADHESIVE POLYORGANOSILOXANE COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015172177
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive polyorganosiloxane composition that exhibits good adhesiveness with respect to heat resistant plastics such as polyphthalic acid amide resin (PPA).SOLUTION: The adhesive polyorganosiloxane composition contains: (A) 100 parts by mass of polyorganosiloxane comprising an alkenyl group containing a trifunctional type siloxane unit comprising an aryl group; (B) polyorganohydrogen siloxane that corresponds to 0.5-2.5 hydrogen atoms per an alkenyl group in the component (A); (C) a platinum-based catalyst; and (D) (a) a siloxane unit that comprises an epoxy group and (b) a bifunctional siloxane unit that comprises an alkenyl group, and 0.05-10 parts by mass of an adhesiveness-imparting agent having 1000-15000 Mw.

Inventors:
OTAKE TATSUYA
TAKAGI AKIRA
MOCHIZUKI KIKUO
Application Number:
JP2014243282A
Publication Date:
October 01, 2015
Filing Date:
December 01, 2014
Export Citation:
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Assignee:
MOMENTIVE PERFORMANCE MAT INC
International Classes:
C08L83/07; C08K5/3492; C08L83/05; C08L83/06; H01L23/29; H01L23/31; H01L33/52
Domestic Patent References:
JP2007327019A2007-12-20
JP2010001335A2010-01-07
JP2011208120A2011-10-20
JPS6485224A1989-03-30
JPS6470559A1989-03-16
JP2012052045A2012-03-15
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office