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Title:
ADHESIVE-REMOVING MATERIAL
Document Type and Number:
Japanese Patent JP2006241389
Kind Code:
A
Abstract:

To obtain an adhesive-removing material capable of easily removing adhesives.

The adhesive-removing material is obtained by dispersing microparticles 0.1-500μm in average size in an elastomeric matrix. In this adhesive-removing material, an organic compound or the like of ≥10,000 average molecular weight(preferably a rubber or the like) can be used as the elastomeric matrix, and as the microparticles, those being ≥1 GPa in modulus can be used, for example, preferably being silica, TiO2, Al2O3. Preferably. this material can be used for removing circuit-connecting adhesives such as anisotropic electrically conductive adhesives.


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Inventors:
ARIFUKU MASAHIRO
KOBAYASHI KOJI
NAKAZAWA TAKASHI
MOCHIZUKI AKIOMI
Application Number:
JP2005061921A
Publication Date:
September 14, 2006
Filing Date:
March 07, 2005
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09D9/02
Domestic Patent References:
JPH05330292A1993-12-14
JPH031997A1991-01-08
JPH11347952A1999-12-21
JPS63309500A1988-12-16
JP2004197109A2004-07-15
Attorney, Agent or Firm:
Kihei Watanabe



 
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