Title:
ADHESIVE SHEET FOR PRODUCTION OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2013023657
Kind Code:
A
Abstract:
To provide an adhesive sheet for production of a semiconductor for preventing cracking and chipping of a semiconductor wafer and the like, exhibiting chemical stability, and allowing easy control of physical properties.
The adhesive sheet for production of a semiconductor device includes: a thermoplastic resin having a carboxyl group while having no epoxy group; a thermosetting resin; and an organic complex forming compound having a benzene ring, which has two or more phenolic hydroxy groups, and forming a complex with a cation.
Inventors:
KIMURA TAKEHIRO
Application Number:
JP2011162241A
Publication Date:
February 04, 2013
Filing Date:
July 25, 2011
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/00; C09J11/04; C09J11/06; C09J201/08; H01L21/52; H01L21/301
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office