Title:
接着剤、及び接着体
Document Type and Number:
Japanese Patent JP7452265
Kind Code:
B2
Abstract:
To provide an adhesive that contains epoxy resin and can form a cured product to exhibit high elongation at -40°C.SOLUTION: An adhesive contains an acryl monomer having two or more (meth)acryloyl groups, epoxy resin having two or more epoxy groups, and a curing agent containing a compound having a nucleophilic reactive group reactable with an epoxy group and/or a (meth)acryloyl group, and a block copolymer elastomer. The block copolymer elastomer has a first block including a monomer unit derived from a first monomer to form a homopolymer having a glass transition temperature of 80°C or higher when polymerized alone, and a second block including a monomer unit derived from a second monomer to form a homopolymer having a glass transition temperature of -30°C or lower when polymerized alone.SELECTED DRAWING: None
Inventors:
Yousuke Touyasu
Masahiro Matsunaga
Yohei Okoda
Toru Tanaka
Masafumi Ohharu
Takashi Kawamori
Masahiro Matsunaga
Yohei Okoda
Toru Tanaka
Masafumi Ohharu
Takashi Kawamori
Application Number:
JP2020098971A
Publication Date:
March 19, 2024
Filing Date:
June 05, 2020
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C09J153/00; C08G59/22; C08G59/50; C09J4/02; C09J11/04; C09J133/04; C09J163/00
Domestic Patent References:
JP1095176A | ||||
JP2012211244A | ||||
JP9077849A | ||||
JP2015137359A | ||||
JP2017014454A | ||||
JP2015143352A |
Foreign References:
US4051195 | ||||
US20190144660 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
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