Title:
接着剤、及び接着体
Document Type and Number:
Japanese Patent JP7452266
Kind Code:
B2
Abstract:
To provide an adhesive that can form a cured product to exhibit high tanδ in a wide temperature range including the low temperature range of 0°C or lower.SOLUTION: An adhesive contains epoxy resin containing dimer acid diglycidyl ester, and a block copolymer elastomer having a polymethyl methacrylate block and a poly n-butylacrylate block.SELECTED DRAWING: None
Inventors:
Yousuke Touyasu
Masahiro Matsunaga
Yohei Okoda
Toru Tanaka
Masafumi Ohharu
Takashi Kawamori
Masahiro Matsunaga
Yohei Okoda
Toru Tanaka
Masafumi Ohharu
Takashi Kawamori
Application Number:
JP2020098973A
Publication Date:
March 19, 2024
Filing Date:
June 05, 2020
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C09J153/00; C08G59/22; C08G59/50; C09J4/02; C09J11/04; C09J133/06; C09J163/00
Domestic Patent References:
| JP2019038926A | ||||
| JP2007284467A | ||||
| JP2015143352A | ||||
| JP2015137359A |
Foreign References:
| WO2014058042A1 | ||||
| US20190144660 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita