Title:
Ag NANOPASTE FOR FORMING RESIDUE-LESS TYPE JOINT
Document Type and Number:
Japanese Patent JP2016093830
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an Ag nanopaste for forming a joint capable of performing a residue-less joint where the occurrence of voids can be suppressed, storage stability is excellent and a residue does not occur.SOLUTION: An Ag nanopaste is dispersed with Ag nanoparticles having an average particle diameter of 1-1,000 μm in at least one kind of solvent selected from among ethylene glycol monophenyl ether, ethylene glycol monobenzyl ether and α-terpineol and contains the solvent of 30-70 vol.% and the balance Ag. The dispersibility of Ag nanoparticles is excellent in spite of not containing an additive and the like such as a rosin, a thixotropic agent and the like being the causes of a residue.SELECTED DRAWING: Figure 1
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Inventors:
KATO RIKIYA
Application Number:
JP2014232076A
Publication Date:
May 26, 2016
Filing Date:
November 14, 2014
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/363; H05K3/34
Domestic Patent References:
| JP2012084633A | 2012-04-26 | |||
| JP2014194057A | 2014-10-09 | |||
| JP2014170864A | 2014-09-18 | |||
| JP2005216508A | 2005-08-11 | |||
| JP2011240406A | 2011-12-01 | |||
| JPH115961A | 1999-01-12 |
Attorney, Agent or Firm:
Shoichi Hirose