Title:
Pb-FREE Mg-Cu-BASED SOLDER ALLOY
Document Type and Number:
Japanese Patent JP2016093831
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide Pb-free solder alloy for high temperature, which has a solidus temperature of about 500°C or lower, is excellent in bondability, workability and reliability, and is substantially inexpensive in comparison with Au-based solder.SOLUTION: In a Pb-free Mg-Cu-based solder alloy containing one or more kinds among Ag, In, Sn and Zn, one or more kinds of Ge and Sb, AL, Ni or P, as accessory components, in addition to Mg and Cu as main components, the content of Cu is 20.0 mass% or more and 48.0 mass% or less.SELECTED DRAWING: None
Inventors:
IZEKI TAKASHI
KOMURO MASAHIKO
BONG SHUNKAI
KOMURO MASAHIKO
BONG SHUNKAI
Application Number:
JP2014232260A
Publication Date:
May 26, 2016
Filing Date:
November 15, 2014
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/28; C22C23/00; H01L21/52; H05K3/34
Attorney, Agent or Firm:
Noriyuki Tsujikawa
Masao Yamamoto
Masao Yamamoto
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