Title:
AGGREGATE SUBSTRATE DIVIDING JIG
Document Type and Number:
Japanese Patent JP2016012663
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an aggregate substrate dividing jig by which each circuit board for electric equipment can be divided from an aggregate substrate with a small force.SOLUTION: The aggregate substrate dividing jig includes: a table 10 on which an aggregate substrate 100 is placed; a first hold member 20 which is coupled to an end of the table 10 in a second direction (Y direction) and defines a first shaft 51 in parallel with a first direction (X direction) as a rotary shaft; a second hold member 30 which is coupled to the first hold member 20 in a freely rotatable manner with a second shaft 61 as a rotary shaft; and a handle 40 coupled to the second hold member 30. The aggregate substrate 100 is held in such a manner that a guide part 101 protrudes from one end of the table 10 closer to the first hold member 20 and that connection parts 122 and 123 are positioned in the vicinity of the first shaft 51. The second hold member 30 includes a plurality of claws 34 for holding a portion of the aggregate substrate 100 in the vicinity of the connection parts 122 and 123 with the first hold member 20.
Inventors:
UKAI HIDEYUKI
Application Number:
JP2014133602A
Publication Date:
January 21, 2016
Filing Date:
June 30, 2014
Export Citation:
Assignee:
ICOM INC
International Classes:
H05K3/00
Domestic Patent References:
| JPS6199305A | 1986-05-17 | |||
| JP2009010034A | 2009-01-15 | |||
| JPH05326223A | 1993-12-10 | |||
| JP2006108341A | 2006-04-20 |
Foreign References:
| US20060071318A1 | 2006-04-06 |
Attorney, Agent or Firm:
Yasuo Itaya
Itaya Masayuki
Katsumi Taguchi
Itaya Masayuki
Katsumi Taguchi