Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE HOUSING CONTAINER AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2016012662
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate housing container capable of efficiently replacing a gas within a container body with a gas for substrate protection while preventing a nozzle member from swinging or an attitude from becoming unstable, and a manufacturing method thereof.SOLUTION: The substrate housing container includes: a container body 1 for housing a semiconductor wafer W in which a lid 10 is fitted to an open front face in a freely removable manner; and ventilation means 40 integrated with the container body 1. At both sides of a rear part of a bottom plate 4 of the container body 1, air supply valves 30 are fitted, respectively, for guiding a purge gas from the outside of the container body 1 to the ventilation means 40. The ventilation means 40 includes: a formation member 41 for forming the rear part of the bottom plate 4 of the container body 1 and a portion of a back wall 7; and nozzle members 47 which are provided integrally with the formation member 41 and communicated to the air supply valves 30 in the container body 1. In a vertical direction of peripheral walls of the nozzle members 47, a plurality of blowout ports 49 are bored side by side for emitting the purge gas from the air supply valves 30 in a front direction of the container body 1.

Inventors:
HASEGAWA AKIHIRO
TOMINAGA KIMINORI
Application Number:
JP2014133596A
Publication Date:
January 21, 2016
Filing Date:
June 30, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHINETSU POLYMER CO
International Classes:
H01L21/673; B65D81/24; B65D85/86
Domestic Patent References:
JP2010270823A2010-12-02
JP2011514014A2011-04-28
Foreign References:
US6098304A2000-08-08
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba