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Patent Searching and Data


Title:
AIR-COOLED ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JPH06301450
Kind Code:
A
Abstract:

PURPOSE: To perform efficient cooling and further to make the temperature distribution of a chip uniform and to obtain a reliability improving method, a method for reducing fan power, reduction of the noise of the whole housing, and diverse development of design.

CONSTITUTION: Flow passages of ≥2 systems are formed in the housing of a high- performance arithmetic machine 1 to provide cooling fans 7 between heat generation bodies in the respective flow passages, provide a flow passage exit below, arrange the cooling fans 7 separately from each other, provide a cooling fan in a corner of a bent flow passage, arrange the cooling fans 7 separately in the horizontal direction, constitute the whole housing in double structure, form the CPU package of a core in a duct shape, or provide a resin molding at the center part of a front panel. Thus, ≥2 flow passages are provided and the cooling fans 7 are provided between the heat generation bodies in the respective flow passages to actualize maintenance similar to conventional maintenance, and to make the temp. distribution of each package and each heat generation body uniform, cooling performance improvement, reliability improvement, reduction of fan power, and reduction of the noise of the whole housing are obtained, and inexpensive and diverse design development can be performed.


Inventors:
KONDO YOSHIHIRO
HONMA TETSURO
IWAI SUSUMU
YAMADA HIROSHI
MORITA KAZUO
ITO HIROSHI
MATSUSHIMA HITOSHI
HATADA TOSHIO
IIDA AKIYOSHI
SHIMOIDE SHINICHI
KUMAGAI KENTA
Application Number:
JP8969593A
Publication Date:
October 28, 1994
Filing Date:
April 16, 1993
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
G06F1/20; (IPC1-7): G06F1/20
Attorney, Agent or Firm:
Ogawa Katsuo