To provide an aligner which efficiently regulates a temperature of a reticle delivered in the aligner from an external, and improves throughput.

The aligner for performing a reticle pattern exposure on a wafer includes: a temperature detection unit, which is arranged in a reticle conveying path from a load port to a reticle stage and detects a temperature of the reticle; a unit for calculating a difference between the reticle temperature detected by the temperature detection unit and either one of a reticle stage atmospheric temperature or a reticle chuck temperature on the reticle stage in conveying the reticle from the load port to the reticle stage; and a control unit for controlling to convey the reticle to the reticle stage without conveying to a reticle storage shelf when the calculated difference is within a predetermined range.