To obtain the subject composition scarcely causing occurrence of gas and sticking of foreign matter to the surface of molded product due to heating in molding, etc., and use at high temperature and useful for containers, etc., for housing semiconductor materials by including an aliphatic polyketone resin and a first amine compound.
This resin composition is obtained by melt-kneading (A) an aliphatic polyketone resin which is preferably a copolymer of carbon monoxide with at least one kind of ethylenic unsaturated compound with (B) a first amine compound such as cetylamine, preferably at a ratio of 0.05-20 pts.wt. component B to 100 pts.wt. component A, preferably at 200-300°C resin temperature by an extruder, kneader, etc. This component A has preferably 210-270°C melting point and 0.8-4 d1/g intrinsic viscosity measured in m-cresol at 60°C by using a capillary viscometer. The component B has preferably ≥180°C boiling point.
| JP5376200 | Blow molding container and molding method |
| JP2005178390 | IMPROVED DISPENSING PACKAGE |
| JPH08324535 | PLASTIC CONTAINER |
UCHIDA YUICHI
TAKAGI MASATO
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