To provide an alkaline soluble polymer having a low hardening shrinkage and excellent in physical properties of the hardened film, a photosensitive resin composition excellent in pattern shape, chemical resistance, physical properties and storing stability of cured products even in curing at a low-temperature region, a manufacturing method of cured relief pattern using the composition, and to provide a semiconductor device comprising the cured relief pattern.

There are provided the alkali soluble polymer having a specific structure, and a photosensitive resin composition containing the same.