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Title:
絶縁薄膜製造用アルコキシシラン-有機ポリマー組成物、及びその用途
Document Type and Number:
Japanese Patent JP4093596
Kind Code:
B2
Abstract:
Disclosed is an alkoxysilane/organic polymer composition for use in producing an insulating thin film, comprising (A) a specific alkoxysilane; (B) a specific organic polymer; and (C) a solvent for alkoxysilane (A) and organic polymer (B), wherein solvent (C) comprises at least one organic solvent selected from the group consisting of amide linkage-containing organic solvents and ester linkage-containing organic solvents. Also disclosed are a silica-organic polymer composits thin film which is produced by a process comprising: forming a thin film of the composition of the present invention; subjecting the thin film to a hydrolysis and dehydration-condensation reaction with respect to the alkoxysilane thereof, to thereby cause the alkoxysilane to be gelled in the thin film; and removing the solvent remaining in the thin film by drying, and a porous silica thin film which is obtained by removing the organic polymer from the silica-organic polymer composite thin film. Both of the silica-organic polymer composite thin film and the porous silica thin film have advantages not only in that these thin films have a low dielectric constant suitable for insulating layers for a multilevel interconnect for a semiconductor device, but also in that these thin films can be produced by a method which can be easily performed in the current process for producing a semiconductor device.

Inventors:
Takaaki Ioka
Tsuneaki Tanabe
Application Number:
JP50691499A
Publication Date:
June 04, 2008
Filing Date:
July 15, 1998
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08L83/04; B32B27/00; C01B33/12; C08J5/18; C08J9/26; C08K5/10; C08K5/20; C08L67/02; C08L69/00; C08L71/02; C09D183/02; C09D183/12; C09D183/14; H01L21/283; H01L21/312; H01L21/314; H01L21/316; H01L21/768; H05K1/00
Domestic Patent References:
JP5125191A
JP7100389A
JP10204292A
JP10247765A
JP10140009A
JP9040786A
JP8245278A
JP8064680A
JP8501823A
JP10509669A
Attorney, Agent or Firm:
Hideo Takei
Takeshi Shimizu
Yoshio Narui
Yoshiaki Matsui